●  开封、制样 Decapsulation, Sampling

●  电性能分析 Electrical Characteristic Analysis

●  形貌观察分析External Visual Analysis

●  成份分析Composition Analysis

●  应力试验Stress Testing

●      单片集成电路 Monolithic

●      混合集成电路 Hybrid IC

●      PCBA组件 PCBA Subassembly

●      分立元件 Discrete Component

●  分立器件Discrete Device

●  微波器件/组件 Microwave Device /Module

●  小型整机 Miniature Complete Appliance

●  机电组件 Electromechanical Subassembly

●  光电器件、光真空器件、电池… photoconducting device

●  纠正设计和研制中的错误 Correct the Error in Design and Manufacturing

●      缩短研制周期，降低研制成本 Shorten the Manufacturing Period and Reduce the Cost

●      提高成品率及产品可靠性 Increase the Yield

●      明确引起产品失效的责任方Make Sure the Responsibility of Product Failure

●  雄厚的科研基础积累与支持 Abundant Scientific Research Experience

●  信息产业部电子元器件失效分析中心 Electronic component failure analysis center of  MII

●  信息产业部失效分析协作网牵头单位 Sponsor of the MII failure analysis cooperated web 

●  承担了大量的国家重点工程用和民用产品的失效分析和分析仲裁任务

Much Experience in Failure Analysis and Analysis Arbitration for National Key Projects and Civilian Industry Products